Researchers at Cadence Design Systems and the University of Notre Dame published “A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling. Abstract: “Accurate thermal analysis of heterogeneous 2.5D/3D-IC packages is essential yet computationally prohibitive. A single full-package FEM simulation can take hours, while AI-based surrogates treat the entire stack as a monolithic prediction target and... read more The post A Composable Thermal Solver For Heterogeneous 2.5D/3D-IC Packages (Cadence, Notre Dame) appeared first on Semiconductor Engineering. ]]>
A Composable Thermal Solver For Heterogeneous 2.5D/3D-IC Packages (Cadence, Notre Dame)
SemiEngineeringSemiEngineering1天前00
Researchers at Cadence Design Systems and the University of Notre Dame published “A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling. Abstract: “Accurate thermal analysis of heter
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