IPC 标准检索库
直接检索 IPC-A-600 / IPC-6012 / IPC-4552 判定条款，附合格与不合格样图对照，客诉判定时快速引用条款编号。
孔内镀层连续性（孔铜空洞） / Barrel Plating Continuity (Voids)
孔壁镀层应连续完整，Class 2 允许不超过 90° 的单一空洞且不超过孔数 5%；Class 3 不允许空洞。切片判定时孔铜断续即判退。
Barrel plating shall be continuous. Class 2 permits a single void up to 90 degrees in up to 5% of holes; Class 3 permits no voids. Discontinuous barrel copper in cross-section is rejectable.
孔铜厚度与热应力完整性 / Barrel Copper Thickness & Thermal Stress Integrity
Class 2 孔铜平均厚度不低于 20μm、局部最小不低于 18μm；热应力试验后孔铜无裂纹、无分层为合格。
Class 2 requires average barrel copper no less than 20 μm and local minimum no less than 18 μm; no cracks or delamination after thermal stress test.
阻焊覆盖与露铜判定 / Solder Mask Coverage & Exposed Copper
阻焊应完整覆盖导线与介质层；Class 2 允许不影响最小电气间隙的侧壁露铜，焊盘区与 BGA 区任何露铜判退。
Mask shall fully cover conductors and dielectric. Class 2 permits sidewall exposed copper not reducing minimum electrical spacing; any exposed copper in pad or BGA areas is rejectable.
阻焊起泡与爆油 / Solder Mask Blistering
阻焊层不允许起泡、起翘或热过程后爆开露铜；任何可见气泡在 Class 3 判退，Class 2 视是否影响绝缘距离判定。
No blistering, lifting or mask blowing exposing copper after thermal processes. Any visible bubble is rejectable for Class 3; Class 2 judged by insulation spacing impact.
分层与起泡（热分层） / Delamination & Blistering
基材与介质层间不允许分层或起泡；热应力与 T-288 试验后出现任何分层扩展即判退，需结合切片与超声波扫描确认。
No delamination or blistering between laminate and dielectric layers. Any propagation after thermal stress or T-288 test is rejectable, confirmed by cross-section or C-SAM.
V-CUT 残厚与板边损伤 / V-CUT Residual Thickness & Edge Damage
V-CUT 残留厚度通常为板厚 1/3 或按图纸公差；切口不允许伤及导线铜层，板边不允许影响结构的崩缺与裂纹。
V-CUT residual thickness is typically one third of board thickness or per drawing tolerance. Cuts shall not damage conductor copper; edge chipping or cracks affecting structure are rejectable.
OSP 膜厚与可焊性 / OSP Film Thickness & Solderability
OSP 膜厚推荐 0.2-0.5μm；按 J-STD-003 做可焊性试验，润湿面积不低于 95%，焊盘不允许氧化变色与拒焊。
OSP film thickness recommended 0.2-0.5 μm. Solderability per J-STD-003 with wetting coverage no less than 95%; no oxidation discoloration or de-wetting on pads.
环圈破裂与偏孔 / Annular Ring Breakout & Drill Misregistration
Class 2 允许外层环圈破裂不超过环宽 20% 且未触及相邻导体；Class 3 不允许破裂；偏孔需保证最小环宽满足设计余量。
Class 2 permits outer annular ring breakout up to 20% of ring width without touching adjacent conductors; Class 3 permits none. Misdrilled holes shall keep minimum ring width within design margin.
蚀刻因子与导线侧蚀 / Etch Factor & Conductor Undercut
导线截面应接近矩形，侧蚀与钻蚀不超过线宽公差；蚀刻薄化导致线宽低于下限或铜厚不足时判退，需结合切片测量。
Conductor cross-section shall be near rectangular with undercut/overcut within trace width tolerance. Etch thinning below trace width or copper thickness limits is rejectable, verified by cross-section.
焊盘表面缺陷与外来物 / Pad Surface Defects & Foreign Inclusion
焊盘表面不允许影响焊接与键合的划痕、凹坑、外来物与残铜；ENIG 焊盘不允许黑盘与镍腐蚀迹象。
Pad surfaces shall be free of scratches, pits, foreign inclusion and residual copper affecting soldering or bonding. ENIG pads shall show no black pad or nickel corrosion signs.
