Process Solutions · Delivery Results

Project Case Library

Selected manufacturing projects from platform-matched factories, showcasing full process capability from design collaboration to volume delivery.

EV Battery Management System BoardAutomotive

EV Battery Management System Board

Factory: 深圳精创电路

8-layer high-TG board for battery management with 120Ω controlled CAN differential pairs, validated across -40°C to 105°C thermal cycling.

Layers

8-layer

Material

High-TG FR-4

Process

ENIG + ±7% impedance

Cert

IATF 16949

|

99.2% production yield, stable delivery for 18 months

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5G Base Station RF Front-End BoardTelecom

5G Base Station RF Front-End Board

Factory: 东莞恒通科技

Hybrid-pressed Rogers RF layers with back-drilled stubs reduced insertion loss by 0.8 dB at 3.5 GHz versus the previous design.

Layers

12-layer hybrid

Material

Rogers 4350B + FR-4

Process

Back-drilling + hybrid press

Tolerance

Impedance ±5%

|

Passed carrier network acceptance, in volume supply

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Medical Patient Monitor MainboardMedical

Medical Patient Monitor Mainboard

Factory: 昆山华新电子

Built to IPC Class 3 acceptance with isolated analog ground zones, meeting medical leakage-current and EMC requirements.

Layers

6-layer

Material

FR-4 IPC-4101

Process

ENIG + conformal coating ready

Standard

IPC-6012 Class 3

|

Passed customer DFM audit and first-article inspection on first submission

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Industrial Controller HDI MainboardIndustrial

Industrial Controller HDI Mainboard

Factory: 深圳精创电路

Via-in-pad with plated fill for 0.65 mm pitch BGAs; two lamination cycles completed 2nd-order blind/buried vias, raising routing density by 40%.

Layers

10-layer 2nd-order HDI

Via

0.1mm laser via

Process

Via-in-pad + plated fill

Trace

3/3 mil

|

Board area reduced 35%, meeting the customer's cost-down target

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German Industrial Sensor Carrier BoardIndustrial

German Industrial Sensor Carrier Board

Factory: 东莞恒通科技

Ordered after a remote factory audit; full English engineering communication, shipped with IPC-6012 Class 2 acceptance report and RoHS declaration.

Layers

6-layer

Material

FR-4 TG170

Process

ENIG + ±10% impedance

Delivery

DDP 慕尼黑

|

3 repeat orders, listed in the customer's AVL

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North American Consumer Electronics Rigid-FlexConsumer

North American Consumer Electronics Rigid-Flex

Factory: 深圳精创电路

Rigid-flex for wearables with rolled copper in dynamic bend zones; passed 100k bend-cycle validation before mass production.

Structure

4-layer rigid-flex

Flex

100k dynamic bends

Process

ENIG + steel stiffener

Cert

UL E-number

|

120k pcs per year with zero batch complaints

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